Dr.-Ing. Dipl.-Inform. Tanja Harbaum
- Team leader of the working groups "Design of adaptive hardware architectures" and "AI in embedded systems"
- Group: Prof. Becker
- Room: 125.2
CS 30.10 - Phone: +49 721 608-47169
- harbaum ∂does-not-exist.kit edu
Engesserstr. 5
76131 Karlsruhe
Design of adaptive hardware architectures
The demands laid down microarchitectures are increasing steadily, and much of the technological innovation of recent decades has only been made possible by the progress of the semiconductor industry and the accomplished increases in integrated circuit performance. A further increase of the
performance of integrated circuits is no longer self-evident, because physical limits will be reached soon. New architectures have to be designed in order to meet the increasing demands at this point.
Artificial intelligence in embedded systems
The performance of embedded systems can be increased enormously by integrating AI algorithms that are adapted to the embedded hardware. Through a hardware/software co-design, a fast and efficient AI execution on embedded systems can be realized. For the development of new cyber-physical systems (CPS) and Internet of Things (IoT) products, AI is becoming an increasingly important factor.
Supervised student works (selection)
- MA: “Konzeptioneller Entwurf eines modularen Sensornetzwerks für intelligente Textilanwendungen”
- BA: ”Evaluation of Various Sensor Fusion Parameters for Online Handwriting Recognition and Trajectory Reconstruction”
- MA: “Evaluation of Robustness against changing weather conditions of Multi Modal AI-based Object Detection”
- MA: “Conceptual and Physical Design of a Hybrid Flexible Electronic System (HyFES) for Motion Tracking”
- SA: “Appropriate Adaptive Algorithms Facing Emerging Challenges for Wearables”
- SA: “A Review of Approximate Computing methods for a Universal Approximate Hardware Accelerator”
- BA: "Design and Modeling of a Runtime Adaptive Accelerator for a Reconfigurable Processor Architecture"
- MA: "Integration of runtime adaptive reconfiguration of hardware accelerators into a LEON3 architecture"
- BA: "Design, Implementation and Evaluation of a Pipeline Architecture for an FPGA Memory Architecture with Pattern Recognition Capability"
- MA: "Entwurf, Implementierung und Evaluierung einer FPGA-Speicherstruktur mit der Fähigkeit der Mustererkennung"
- BA: "Design, Implementation and Evaluation of a Memory Architecture in XILINX B-RAM"
Publications
Kreß, F.; Sidorenko, V.; Schmidt, P.; Hoefer, J.; Hotfilter, T.; Walter, I.; Harbaum, T.; Becker, J.
2023. Computer Networks, 229, Article no: 109759. doi:10.1016/j.comnet.2023.109759
Hotfilter, T.; Höfer, J.; Kreß, F.; Kempf, F.; Kraft, L.; Harbaum, T.; Becker, J.
2023. 2023 IEEE 5th International Conference on Artificial Intelligence Circuits and Systems (AICAS), 1–5, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/AICAS57966.2023.10168566
Hoefer, J.; Kempf, F.; Hotfilter, T.; Kreß, F.; Harbaum, T.; Becker, J.
2023. Proceedings of the Great Lakes Symposium on VLSI 2023, 287–292, Association for Computing Machinery (ACM). doi:10.1145/3583781.3590226
Lesniak, F.; Anantharajaiah, N.; Harbaum, T.; Becker, J.
2023. RAPIDO ’23: Proceedings of the DroneSE and RAPIDO: System Engineering for constrained embedded systems, 31–38, Association for Computing Machinery (ACM). doi:10.1145/3579170.3579262
Hotfilter, T.; Schmidt, P.; Höfer, J.; Kreß, F.; Harbaum, T.; Becker, J.
2023. DroneSE and RAPIDO: System Engineering for constrained embedded systems, 73–78, Association for Computing Machinery (ACM). doi:10.1145/3579170.3579258
Kreß, F.; Hoefer, J.; Hotfilter, T.; Walter, I.; El Annabi, E. M.; Harbaum, T.; Becker, J.
2023. Machine Learning and Principles and Practice of Knowledge Discovery in Databases. Hrsg.: I. Koprinska. Pt. 1, 557–568, Springer International Publishing. doi:10.1007/978-3-031-23618-1_37
Kempf, F.; Höfer, J.; Kreß, F.; Hotfilter, T.; Harbaum, T.; Becker, J.
2022. Conference Proceedings: 2022 IEEE 35th International System-on-Chip Conference (SOCC) Ed.: S. Sezer, 1–6, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/SOCC56010.2022.9908110
Kreß, F.; Hoefer, J.; Hotfilter, T.; Walter, I.; Sidorenko, V.; Harbaum, T.; Becker, J.
2022. 18th International Conference on Distributed Computing in Sensor Systems (DCOSS), 133–140, IEEEXplore. doi:10.1109/DCOSS54816.2022.00034
Kreß, F.; Serdyuk, A.; Hotfilter, T.; Höfer, J.; Harbaum, T.; Becker, J.; Hamann, T.
2022. 2022 11th Mediterranean Conference on Embedded Computing (MECO). Ed.: IEEE, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/MECO55406.2022.9797131
Pfau, J.; Reuter, M.; Harbaum, T.; Hofmann, K.; Becker, J.
2020. 2019 32nd IEEE International System-on-Chip Conference (SOCC), Singapore, 3-6 Sept. 2019, 294–299, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/SOCC46988.2019.1570548289
Harbaum, T.
2019. Karlsruher Institut für Technologie (KIT). doi:10.5445/IR/1000096122
Harbaum, T.; Balzer, M.; Becker, J.; Weber, M.
2018. Proceedings of the 31th IEEE International System-on-Chip Conference (SOCC), 118–123, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/SOCC.2018.8618493
Harbaum, T.; Schade, C.; Damschen, M.; Tradowsky, C.; Bauer, L.; Henkel, J.; Becker, J.
2017. 2017 30th IEEE International System-on-Chip Conference (SOCC), Munich, 5–8 September 2017, 153–158, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/SOCC.2017.8226027
CMS Collaboration; Khachatryan, V.; Sirunyan, A. M.; Tumasyan, A.; Adam, W.; Asilar, E.; Bergauer, T.; Brandstetter, J.; Brondolin, E.; Dragicevic, M.; Erö, J.; Flechl, M.; Friedl, M.; Frühwirth, R.; Ghete, V. M.; Hartl, C.; Hörmann, N.; Hrubec, J.; Jeitler, M.; Harbaum, T.; et al.
2016. Physical review / D, 93 (11), 112009. doi:10.1103/PhysRevD.93.112009
Tradowsky, C.; Harbaum, T.; Masing, L.; Becker, J.
2016. Best of ISVLSI 2016, Pittsburgh, Pennsylvania, U.S.A., July 11-13, 2016, Springer
Harbaum, T.; Seboui, M.; Balzer, M.; Becker, J.; Weber, M.
2016. 24th IEEE International Symposium on Field-Programmable Custom Computing Machines, FCCM 2016; Washington; United States; 1 May 2016 through 3 May 2016, 184–191, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/FCCM.2016.52
Amstutz, C.; Ball, F. A.; Balzer, M. N.; Brooke, J.; Calligaris, L.; Cieri, D.; Clement, E. J.; Hall, G.; Harbaum, T. R.; Harder, K.; Hobson, P. R.; Iles, G. M.; James, T.; Manolopoulos, K.; Matsushita, T.; Morton, A. D.; Newbold, D.; Paramesvaran, S.; Pesaresi, M.; Reid, I. D.; et al.
2016. 20th Real Time Conference (RT), IEEE-NPSS, Padova, Italy, 6-10 June 2016, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/RTC.2016.7543102
Amstutz, C.; Ball, F. A.; Balzer, M. N.; Brooke, J.; Calligaris, L.; Cieri, D.; Clement, E. J.; Hall, G.; Harbaum, T. R.; Harder, K.; Hobson, P. R.; Iles, G. M.; James, T.; Manolopoulos, K.; Matsushita, T.; Morton, A. D.; Newbold, D.; Paramesvaran, S.; Pesaresi, M.; Reid, I. D.; et al.
2016. 20th Real Time Conference (RT) IEEE-NPSS, Padova, Italy, 6-10 June 2016, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/RTC.2016.7543110
Aad, G.; Abbott, B.; Abdallah, J.; Abdinov, O.; Aben, R.; Abolins, M.; Abouzeid, O. S.; Abramowicz, H.; Abreu, H.; Abreu, R.; Abulaiti, Y.; Acharya, B. S.; Adamczyk, L.; Adams, D. L.; Adelman, J.; Adomeit, S.; Adye, T.; Affolder, A. A.; Agatonovic-Jovin, T.; Harbaum, T.; et al.
2015. Physical review letters, 114 (19), 191803. doi:10.1103/PhysRevLett.114.191803
Tradowsky, C.; Harbaum, T.; Deyerle, S.; Becker, J.
2013. IEEE Computer Society Annual Symposium on VLSI (ISVLSI’13), Natal, Brazil, August 5-7, 2013, 34–39, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/ISVLSI.2013.6654619
Oberländer, J.; Harbaum, T.; Kurz, G.; Ahmed, N.; Kos-Grabar, T.; Hermann, A.; Roenau, A.; Dillmann, R.
2012. Field robotics : proceedings of the 14th International Conference on Climbing and Walking Robots and the Support Technologies for Mobile Machines, CLAWAR 2011, Paris, France, 6-8 September 2011. Ed.: P. Bidaud, 233–240, World Scientific Publishing