Dipl.-Ing. Florian Oszwald

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Zu vergebende studentische Arbeiten
Titel Datum

Publikationen


2021
Proceedingsbeiträge
XANDAR: X-by-Construction Design framework for Engineering Autonomous & Distributed Real-time Embedded Software Systems
Becker, J.; Masing, L.; Dörr, T.; Schade, F.; Keramidas, G.; Antonopoulos, C. P.; Mavropoulos, M.; Tiganourias, E.; Kelefouras, V.; Antonopoulos, K.; Voros, N.; Durak, U.; Ahlbrecht, A.; Zaeske, W.; Panagiotou, C.; Karadimas, D.; Adler, N.; Sailer, A.; Weber, R.; Wilhelm, T.; Oszwald, F.; Reinhardt, D.; Chamas, M.; Bekan, A.; Smethurst, G.; Siddiqui, F.; Khan, R.; Garousi, V.; Sezer, S.; Morales, V.
2021. Proceedings 2021 31st International Conference on Field-Programmable Logic and Applications: FPL 2021 ; Dresden, Germany, 30 August – 3 September 2021, 382–383, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/FPL53798.2021.00075
2020
Proceedingsbeiträge
Model-Based Design of Service-Oriented Architectures for Reliable Dynamic Reconfiguration
Oszwald, F.; Obergfell, P.; Liu, B. B.; Victor Pazmino; Becker, J.
2020. WCX 2020 SAE World Congress Experience, Detroit, MI, April 21-23, 2020. Proceedings. doi:10.4271/2020-01-1364
Evaluation Methodologies in the Development of Dynamically Reconfigurable Systems in the Automotive Industry
Oszwald, F.; Bertelo, R.; Gericota, M.; Becker, J.
2020. WCX SAE World Congress Experience, Detroit, MI, April 21-23, 2020. Proceedings. doi:10.4271/2020-01-1363
Automatically reconfigurable actuator control for reliable autonomous driving functions (AutoKonf)
Orlov, S.; Korte, M.; Oszwald, F.; Vollmer, P.
2020. 10th International Munich Chassis Symposium 2019 : chassis.tech plus. Ed.: P. E. Pfeffer, 355–368, Springer Fachmedien Wiesbaden. doi:10.1007/978-3-658-26435-2_26
2019
Proceedingsbeiträge
Establishing and Enhancing Agility with Model-based Systems Engineering
Oszwald, F.; Obergfell, P.; Meseth, M.; Chamas, M.; Traub, M.; Becker, J.; Sax, E.
2019. Proceedings of the 19th International Congress Electronics in Vehicles (ELIV), 16. - 17. Oktober 2019
Reliable Fail-Operational Automotive E/E-Architectures by Dynamic Redundancy and Reconfiguration
Oszwald, F.; Obergfell, P.; Traub, M.; Becker, J.
2019. 32nd IEEE International System on Chip Conference, SOCC 2019; Singapore; Singapore; 3 September 2019 through 6 September 2019. Ed.: D. Zhao, 203–208, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/SOCC46988.2019.1570547977
Entwicklung eines Informationsmodells für eine Hochintegrationsplattform im Automotive-Umfeld [in press]
Chamas, M.; Hopfensitz, W.; Obergfell, P.; Oszwald, F.; Traub, M.
2019. Tag des Systems Engineering, München, 06.-08. November 2019. Hrsg.: Gesellschaft für Systems Engineering e.V
Reliable Fail-Operational Automotive E/E-Architectures by Dynamic Redundancy and Reconfiguration [in press]
Oszwald, F.; Obergfell, P.; Traub, M.; Becker, J.
2019. Proceedings of the 32nd IEEE International System-on-Chip Conference (SOCC), Singapur, 3 - 6 September 2019
2018
Proceedingsbeiträge
Using simulation techniques within the design of a reconfigurable architecture for fail-operational real-time automotive embedded systems
Oszwald, F.; Obergfell, P.; Traub, M.; Becker, J.
2018. 4th IEEE International Symposium on Systems Engineering, ISSE 2018; Rome Marriott Park HotelRoma; Italy; 1 October 2018 through 3 October 2018, Art. Nr.: 8544451, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/SysEng.2018.8544451
Viewpoint-Based Methodology for Adaption of Automotive E/E-Architectures
Obergfell, P.; Oszwald, F.; Traub, M.; Sax, E.
2018. 2018 IEEE 15th International Conference on Software Architecture Companion (ICSA-C 2018), April 30 - May 4, 2018, Seattle, WA, 128–135, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/ICSA-C.2018.00041
Dynamic reconfiguration for real-time automotive embedded systems in fail-operational context
Oszwald, F.; Becker, J.; Obergfell, P.; Traub, M.
2018. 32nd IEEE International Parallel and Distributed Processing Symposium Workshops, IPDPSW 2018; Vancouver; Canada; 21 May 2018 through 25 May 2018, 206–209, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/IPDPSW.2018.00039